Catalog

  • MP160AXP-2C

    Used for melting lead free babbitt, solder, lead, tin, zinc, pewter, babbittt and other metals with melting points below 1000 degrees F. These units are engineered for durability and longevity, plus they are easy to service. Standard Features: heavy cast iron crucibles and plate fabricated custom sizes, replaceable elements for easy field service always in stock, ceramic and glass insulation to minimize heat loss. The adjustable digital temperature control with thermocouple mounted in a titanium sleeve for protection.

  • mp10xfr-15-1

    Used for melting lead free babbitt, solder, lead, tin, zinc, pewter, babbittt and other metals with melting points below 1000 degrees F. These units are engineered for durability and longevity, plus they are easy to service. Standard Features: heavy cast iron crucibles and plate fabricated custom sizes, replaceable elements for easy field service always in stock, ceramic and glass insulation to minimize heat loss, and adjustable thermostatic control.

  • rsp2-13-2

    Specially designed for printed circuit board fabrication and tinning operations. A wide open top and shallow depth allows maximum dipping efficiency for flat or edge dipped apparatus. Wide flanges can also be machined or drilled and tapped to accept mechanical dipping assemblies. Tanks are available in standard sizes of 10 to 135 pound capacities. Custom tanks can be fabricated to just about any size or configuration from a wide variety of materials.